1 micromodul? connectors, pitch 1.27 mm micromodul? tab header, upright, in surface mount technology (smt), solder contacts dual row staggered, with press-fit spigots, on reel, with pick-and-place top state: active approvals: of 4 30 mics/smd rp 01/2018 ps q k u a r l a i m t y e n e c m a t r i i o f n n d o e c l e a d f n a o b i r t i a c c a i f c i i t o r n e c ps q k u a r l a i m t y e n e c m a t r i i o f n n d o e c l e a d f n a o b i r t i a c c a i f c i i t o r n e c
2 environmental conditions temerature range 0 c0 c 1 1 upper limit temperature (insulating body) rti (electrical) of the ul yellow card materials nsulating bod p 0 according to u contact tab cun renicel and tinlated mcmd p cun renicel and goldlated mcmd p u mechanical data eression orce contact tab rom insulating bod ncontact electrical data (at t amb 20 c) ated current 2 ated voltage 0 c (20 c ohne ercsichtigung der riech und utstrecen nach ec 0dn en 0) material grou (ec) (u) (ct 0) creeage distance 0 mm clearance 0 mm nsulation resistance o 30 mics/smd rp 01/2018 *i
3 *a press-fit spigot *b smt solder area, contact bearing surface 0.3 x 1.2 mm *c pick-and-place top *d contact 1 *e printed circuit board layout, components side view *f necessary space for use of pull-off tongs az30 *g component area (b x 7) *h recommended thickness of circuit board 1.5 0.14 mm *i coplanarity of 4 30 mics/smd rp 01/2018
4 designation pole number pu (pieces) mdq (pieces) dimensions (mm) (mm) c (mm) d (mm) e (mm) mcmd 0 p 00 00 mcmd 0 p 00 00 0 020 mcmd 0 p 00 00 2 mcmd 0 p 0 00 00 2 mcmd 2 p 2 00 00 02 2 02 mcmd p 00 00 2 20 02 mcmd p 00 00 0 20 220 02 mcmd p 00 00 2 2 2 02 00 mcmd 20 p 20 00 00 2 2 2 02 mcmd 2 p 2 200 200 0 0 2 mcmd 0 0 u p 00 00 mcmd 0 0 u p 00 00 mcmd 0 0 u p 00 00 mcmd 0 0 u p 0 00 00 mcmd 0 u p 00 00 mcmd 0 u p 00 00 mcmd 20 0 u p 20 00 00 mcmd 0 0 u p 00 00 mcmd 0 0 u p 00 00 mcmd 0 0 u p 00 00 mcmd 0 0 u p 0 00 00 mcmd 2 0 u p 2 00 00 mcmd 0 u p 00 00 mcmd 20 0 u p 20 00 00 packaging: on reel of 4 30 mics/smd rp 01/2018
|
